At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

Job title: Advanced R&D – Physical Design Engineer

Location : Lausanne, Switzerland

The Physical Design (PD) Engineer translates high-speed communication IP digital designs into physical GDSII layouts for advanced FinFET nodes. You will bridge logic design, owning block-to-chip implementation from netlist to final physical sign-off, ensuring PPA (Power, Performance, and Area) targets are met.

Immediate key objective

• Drive block-level physical implementation—covering synthesis, SDC constraints, floorplanning, placement, CTS, and routing—meeting strict frequency, area, and power targets.

• Execute timing closure across multiple corners and modes (MCMM) utilizing static timing analysis (STA) and generating targeted ECOs.

• Drive full physical verification closure sign-off in deep-submicron FinFET technologies.

Responsibility

• Own block synthesis, floorplanning, placement optimization, CTS, and routing.

• Develop and refine SDC constraints to ensure design intent matches physical realization.

• Collaborate with the digital design team to resolve logic or architectural bottlenecks affecting P&R convergence.

• Generate progress reports, document implementation flows, and prepare sign-off packages for tape-out.

Required Experience

• 5+ years of hands-on physical design experience focusing on synthesis, SDC constraints, CTS, and place and route for high-speed systems.

• Strong technical background in deep-submicron CMOS/FinFET physical effects, crosstalk, and high-frequency clock network design.

• Proven experience of taking complex blocks from netlist through successful physical implementation.

• Direct experience with advanced low-power implementation techniques (UPF, power gating).

• Proven tape-out experience in advanced FinFET nodes (e.g., 7nm, 5nm, or 3nm).

• Experience handling complex block-to-chip hierarchical assembly, pin placement, and top-level routing constraints..

Required Skills

• Expert proficiency with industry-standard implementation and sign-off tools (e.g., Cadence Genus/Innovus/Tempus or Synopsys Design Compiler/ICC2/PrimeTime, and Calibre).

• Deep understanding of SDC creation, and MCMM timing management.

• Strong scripting skills (Tcl, Python) for flow automation and design data analysis.

• Analytical mindset to debug congestion routing issues, and complex timing violations.

• Self-motivated with strong sense of ownership; effective communicator and team player

Required Education

• Masters or Ph.D. in E.E., Communications or other relevant fields

https://kandou.ai/

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